Premium Sn63Pb37 Leaded Solder Paste for SMT/BGA – 500g (HQY-66337)

✅ Alloy: High-purity Sn63/Pb37 (Eutectic).
✅ Melting Point: 183°C.
✅ Performance: Excellent continuous printing, high tackiness, and low voiding.
✅ Application: Ideal for SMT reflow soldering, PCB assembly, and BGA repair.
✅ Net Weight: 500g per jar.

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Premium Sn63Pb37 Leaded Solder Paste

Our high-quality Sn63Pb37 Leaded Solder Paste (Model: HQY-66337) is engineered for exceptional SMT printing and reflow soldering performance. Featuring the classic eutectic alloy composition (63% Tin / 37% Lead), it provides a precise melting point of 183°C. It ensures excellent tack time, prevents slumping, and delivers highly reliable, bright solder joints for complex BGA and high-density PCB assemblies.

Key Attributes:

Product Name	Leaded Solder Paste (有铅锡膏)
Model Number	HQY-66337
Alloy Composition	Sn63/Pb37 (63% Tin, 37% Lead)
Melting Point	183°C (361°F)
Net Weight	500g / Jar
Storage Condition	Refrigerated storage at 2°C – 10°C
Brand	HONCHS

* Usage Tip: Please allow the solder paste to warm up to room temperature naturally before opening the jar to prevent moisture condensation.

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